Publications

• RTL-3D: Timing-aware Tier Partitioning for 3D ICs Using Pre-synthesis Timing Analysis
  Haoyang Xu, Zheng Yang, Zhen Zhuang, Leilei Jin, Bei Yu, Sung Kyu Lim, and Tsung-Yi Ho.
  63nd ACM/IEEE Design Automation Conference (DAC), 2026.
• Mixed-structure double-sided redistribution layer routing for glass interposer-based 5.5d ics
  Haoyang Xu, Zhen Zhuang, Leilei Jin, Zheng Yang, Chen Wu, Lei He, Sung Kyu Lim, and Tsung-Yi Ho.
  63nd ACM/IEEE Design Automation Conference (DAC), 2026.
• Graph Attention-Based Current Crowding Analysis at TSV Interfaces in 3D Power Delivery Networks
  Zheng Yang, Zhen Zhuang, Tsung-Yi Ho, and Sung Kyu Lim.
  31st IEEE/ACM Asia South Pacific Design Automation Conference (ASPDAC), 2026.
• DPO-3D: Differentiable Power Delivery Network Optimization via Flexible Modeling for Routability and IR-Drop Tradeoff in Face-to-Face 3D ICs
  Zhen Zhuang, Zheng Yang, Yuxuan Zhao, Jiawei Hu, Bei Yu, Sung Kyu Lim, and Tsung-Yi Ho
  31st IEEE/ACM Asia South Pacific Design Automation Conference (ASPDAC), 2026.
• On-chip Integrated Voltage Regulators: Frontside, Backside, or Off-Chip?
  Amaan Rahman, Seungmin Woo, Zheng Yang and Sung Kyu Lim.
  ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED), 2025.
• ML-Based Fine-Grained Modeling of DC Current Crowding in Power Delivery TSVs for Face-to-Face 3D ICs
  Zheng Yang, Zhen Zhuang, Bei Yu, Tsung-Yi Ho, Martin D.F. Wong, Sung Kyu Lim.
  34th ACM International Symposium on Physical Design (ISPD), 2025.